The
2004 Ottawa School Districts Bond Improvement projects consisted
of one new four unit elementary school (Lincoln), one total renovation
and doubling of the size of another elementary school (Garfield),
with major improvements to the insulation, maintenance and cost of
operation, as well as the building renovation and major replacement
including the re-design of the heating and air-conditioning system
at Ottawa High School. The total bond issue amount for this work
was $25.9 million.
The construction cost for Garfield was approximately $9 million.
The
2004 Ottawa School Districts Bond Improvement projects consisted
of one new four unit elementary school (Lincoln), one total renovation
and doubling of the size of another elementary school (Garfield),
with major improvements to the insulation, maintenance and cost of
operation, as well as the building renovation and major replacement
including the re-design of the heating and air-conditioning system
at Ottawa High School. The total bond issue amount for this work
was $25.9 million. 
