The 2004 Ottawa School Districts Bond Improvement projects consisted of one new four unit elementary school (Lincoln), one total renovation and doubling of the size of another elementary school (Garfield), with major improvements to the insulation, maintenance and cost of operation, as well as the building renovation and major replacement including the re-design of the heating and air-conditioning system at Ottawa High School. The total bond issue amount for this work was $25.9 million.
The construction cost for Lincoln was approximately $12 million.